Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
Beth Keser, Ph.D., is a recognized global leader in the semiconductor industry with over 20 years' experience resulting in 28 patents and patents pending and over 40 publications. She is an IEEE Senior Member whose volunteer activities and professional society responsibilities include: IEEE EPS' VP of Education, 2015 ECTC General Chair, and more.
Steffen Kröhnert, M.SC., is Senior Director of Technology Development at Amkor Technology Holding B.V., Germany. He has more than 20 years' experience in the semiconductor industry. Steffen is author and co-author of 23 patent filings in the area of Semiconductor Packaging Technology, and an active member of IEEE EPS, IMAPS, SMTA, VDI, VDE and GPM.
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Beth Keser, Ph.D., is a recognized global leader in the semiconductor industry with over 20 years' experience resulting in 28 patents and patents pending and over 40 publications. She is an IEEE Senior Member whose volunteer activities and professional society responsibilities include: IEEE EPS' VP of Education, 2015 ECTC General Chair, and more.
Steffen Kröhnert, M.SC., is Senior Director of Technology Development at Amkor Technology Holding B.V., Germany. He has more than 20 years' experience in the semiconductor industry. Steffen is author and co-author of 23 patent filings in the area of Semiconductor Packaging Technology, and an active member of IEEE EPS, IMAPS, SMTA, VDI, VDE and GPM.
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